Program Committee


Mohamed Abdelwahab, Kyushu University, Japan
Christian Beecks, RWTH Aachen University, Germany
Pierre Boulanger, University of Alberta, Canada
Chao Chen, Capital One Bank, USA
Ming Chen, Apple Inc. , USA
Zhineng Chen, Chinese Academy of Sciences, China
Wen-Huang Cheng, Academia Sinica, China
Simon Clippingdale, NHK, Japan
Nuno Correia, New University of Lisbon, Portugal
Oche Ejembi, University of St Andrews, United Kingdom
Gabriel Falcao, University of Coimbra, Portugal
Jianping Fan, UNCC, USA
Shaobo Fang, Purdue University, USA
Youhan Fang, Purdue University, USA
Lei Gao, Ryerson University, Canada
Juan Gremes Cordero, Instituto Tecnologico de Buenos Aires, Argentina
jin guo, Towson University, USA
Wenzhangzhi Guo, University of Toronto, Canada
Marwan Hassani, RWTH Aachen University, Germany
Takahiro Hayashi, Niigata University, Japan
Haimiao Hu, Beihang Univeristy, China
Qingming Huang, University of Chinese Academy of Sciences, China
Jia Jia, Tsinghua University, China
xiaochen Jing, KLA-Tencor, USA
Mohan Kankanhalli, National University of Singapore, Singapore
Hyung-Il Kim, KAIST, Republic of Korea
Sebastien Lafond, Abo Akademi Uninersity, Finland
Jui-Hsin(Larry) Lai, IBM T.J. Watson Research Center, USA
Dawei Li, Lehigh University, USA
Ming Li, California State University, USA
Xirong Li, Renmin University of China, China
Zechao Li, Nanjing University of Science and Technology, China
Liang Liu, Beijing University of Post and Telecommunications, China
Cheng Lu, Sony , USA
Yao Lu, University of California, San Diego, USA
Hongli Luo, IPFW, USA
Venkata Phani Kumar M, IIT Kharagpur, India
Siwei Ma, Peking University, China
Qirong Mao, Jiangsu University, China
Baoning Niu, Taiyuan University of Technology, China
Oluwafolake Ojo, Federal University of Agriculture, Abeokuta, Nigeria
Ayodeji Oluwatope, Obafemi Awolowo University, Nigeria
Chahid Ouali, ÉTS (École de Technologie Supérieure), Canada
Khandaker Rahman, Saginaw Valley State University, Michigan, USA
Tongwei Ren, Nanjing University, China
Nestor Salamon, TUDelft, Brazil
Jitao Sang, CAISA, China
Klaus Schoeffmann, Klagenfurt University, Austria
Ju Shen, University of Dayton, USA
Shervin Shirmohammadi, University of Ottawa, Canada
Lifeng Sun, Tsinghua Univeristy, China
Qingquan Sun, California State University San Bernardino, USA
Supphachai Thaicharoen, Srinakharinwirot University, Thailand
Hongda Tian, University of Wollongong, Australia
Xinmei Tian, University of Science and Technology of China, China
Yan Tong, University of South Carolina, USA
Jianyu Wang, Facebook Inc., USA
Qifan Wang, Google Inc. , USA
Weibao Wang, Apple Inc. , USA
Yonggang Wen, Nanyang Technological University, Singapore
Yi-Leh Wu, National Taiwan University of Science and Technology, Taiwan, R.O.C.
Benjamin Wulff, Fraunhofer IAIS, Germany
Jin Xu, University of Electronic Science and Technology of China, China
Toshihiko Yamasaki, The University of Tokyo, Japan
Yimin Yang, Florida International University, USA
Jun Ye, University of Central Florida, USA
Faycal Ykhlef, CDTA, Algeria
Tracy Zhang, UAB, USA
Weigang Zhang, Harbin Institute of Technology, Weihai, China
Shandian Zhe, Purdue University, USA
Liansheng Zhuang, University of Science and Technology of China, China
Esfandiar Zolghadr, Florida Atlantic University, USA